Home – Quality

Quality Assurance

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Quality Commitments

The key factor in our success is HIGH QUALITY PRODUCT We are committed to maintain high quality standards during production process All material and components are inspected at each stage of production with reference STDs, so that the quality of the final product follows international standards This whole process is being handled by an expert quality team.
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RM Receipt inspection & Storage

Various tests are conducted during Incoming Quality Control (IQC) in accordance with IPC-600 and IPC-TM-650 standards to validate the quality of incoming materials.
Materials are stored in accordance with the Standard Operating Procedures (SOPs) to ensure proper handling and preservation.
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Drilling QC

An automatic hole-checking machine is utilized to identify any abnormalities in the drilled holes, such as missing holes, half holes, ovel holes, holes location and incorrect diameters.

100% through-hole checking is performed on every panel after drilling.
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Photo Printing QC

The circuit is checked against the GERBER data provided by the customer.

After photo printing, 100% inspection is conducted through Automated Optical Inspection (AOI)."
Photo printing is carried out in a Class 10,000 cleanroom to ensure contamination control."
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Micro Section

Microsection testing (also known as cross-section analysis) is a destructive testing method used primarily in the PCB (Printed Circuit Board) industry to evaluate internal structural quality, especially for plated through holes (PTH), vias, and layer alignment. The quality of PTH is verified through microsection testing, and every lot must pass this test in accordance with IPC-600 or any specific customer requirements.

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Etching QC

The circuit is checked against the GERBER data provided by the customer.

After Etching process 100% inspection is conducted through Automated Optical Inspection (AOI)
Automated Optical Inspection (AOI) is used to detect all surface and pattern defects on the PCB after the etching process.
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Electrical Testing

Bare circuit boards (PCBs without components) are typically tested for continuity and isolation to ensure there are no open circuits or short circuits by using universal & flying probe testing.

Each and every PCB undergoes 100% Bare Board Testing (BBT) to verify continuity and detect any open or short circuits as per quality standards."
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Final Quality Control

To check and validate the quality of the product, various tests are performed including the Solderability Test, Hole Checking, Automated Visual Inspection (AVI), and Profile Verification using a Video Measuring System (VMS).

Visual inspection is also carried out at various stages to identify any aesthetic defects such as scratches, damage & other color variations.
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Product Testing Standard

1) Solderability Test
2) Thermal Shock Test
3) Peel Strength Test
4) Surface Insulation Test
5) Ionic Contamination Test
6) Masking & Legend Adhesion Test
7) Micro-section (PTH, Surface, Masking & Tin)
8) Bow & Twist
9) Surface finish thickness
10) Dimensional & Profile with VMS
Acceptance criteria as per IPC or as per Customer specified requirement.

Curious to Know More?

In a strategic move to strengthen our manufacturing capabilities and adopt cutting-edge technology, Team Signum recently completed a successful visit to China to explore and procure state-of-the-art equipment for our upcoming PCB production unit in Jammu.

The visit was part of our continuous commitment to innovation and excellence in the PCB industry. During the tour, our senior technical and operations team engaged with leading global manufacturers of PCB machinery and automation systems. The objective was to identify and integrate next-generation equipment that would enhance production efficiency, quality control, and scalability at our new facility.

A POSH (Prevention of Sexual Harassment) training awareness session was successfully conducted at Signum by an external trainer, Ms. Malvika.

Signum has successfully completed an audit with KIA Motors on 06-11-2024

In a strategic move to strengthen our manufacturing capabilities and adopt cutting-edge technology, Team Signum recently completed a successful visit to China to explore and procure state-of-the-art equipment for our upcoming PCB production unit in Jammu.

The visit was part of our continuous commitment to innovation and excellence in the PCB industry. During the tour, our senior technical and operations team engaged with leading global manufacturers of PCB machinery and automation systems. The objective was to identify and integrate next-generation equipment that would enhance production efficiency, quality control, and scalability at our new facility.

Team Signum Visits China to Upgrade Equipment for Advanced PCB Production at New Jammu Facility

In a strategic move to strengthen our manufacturing capabilities and adopt cutting-edge technology, Team Signum recently completed a successful visit to China to explore and procure state-of-the-art equipment for our upcoming PCB production unit in Jammu.

The visit was part of our continuous commitment to innovation and excellence in the PCB industry. During the tour, our senior technical and operations team engaged with leading global manufacturers of PCB machinery and automation systems. The objective was to identify and integrate next-generation equipment that would enhance production efficiency, quality control, and scalability at our new facility.

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